Six Layer Board Stack-Up - Advantech SOM-ETX Series Design Manual

4.1.2 Six layer board stack-up

Figure 4.2 illustrates an example of a six-layer stack-up with 4 signal layers and 2
power planes. The two power planes are the power layer and the ground layer. The
layer sequence of component-ground-IN1-IN2-power-solder is the most common
stack-up arrangement from top to bottom.
Table 4.2 Recommended Board Stack-Up Dimensions
Dielectric Layer
Thickness
No
(mil)
1.7 L1
4
1.4 L2
5
1.4 L3
35
1.4 L4
5
1.4 L5
4
1.7 L6
Notes :
Target PCB Thickness totals 62mil+/-10%
Advantech SOM-ETX Design Guide
L1 Signal Layer
Prepreg
L2 Ground Layer
Core
L3 IN1
Prepreg
L4 IN2
Core
L5 Power Layer
Prepreg
L6 Signal Layer
Figure 4-2
Layer Single-End Signals
Width Impedance
Type
(mil) (ohm)
Signals 5/5 55+/-10%
Prepreg
Ground
Core
IN1 5/5 55+/-10%
Prepreg
IN2
Core 5/5 55+/-10%
Power
Prepreg
Signals 5/5 55+/-10%
Chapter 4 General Design Recommendations
Total
Thickness
62 mils
Differential Signals USB differential Signals
Width Impedance Width
(mil) (ohm) (mil)
5/6/5 100+/-10% 5/4/5
4/8/4 100+/-10% 4/5/4
4/8/4 100+/-10% 4/5/4
5/6/5 100+/-10% 5/4/5
Impedance(ohm)
90+/-10%
90+/-10%
90+/-10%
90+/-10%
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