Environmental; Block Diagram - Advantech MIO-5393 User Manual

9th/8th gen. intel xeon/ core hseries processor, 3.5" mi/ocompact sbc, ddr4, dp, hdmi, 48-bit lvds, 2 gbe, m.2 e key, m.2 b key, mioe
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Max load
E-2276ME: 102.75W
i7-9850HE: 95.38W
i7-9850HL: 44.55W
i5-8400H: 74.44W
Idle mode
E-2276ME/i7-9850HE/i7-9850HL/i58400H: 11.55W
Power Consumption Conditions:
Test software:
1. Intel (R) Thermal Analysis Tool 6.5.1001 (CPU-All and Gfx with 100%).
2. BrunIn Test V8.1 Pro (1025)(CPU, RAM, 2D&3D Graphics and Disk
with 100%)
Max. load: Measure the maximum current value which system under maxi-
mum load (CPU: Top speed, RAM &Graphic: Full loading)
Idle mode: Measure the current value when system in windows mode and
without running any program
RTC Battery:
Typical Voltage: 3.0 V
Normal discharge capacity: 210 mAh
1.2.5

Environmental

Operating Temperature: 0 ~ 60°C (32 ~ 140°F)
Operating Humidity: 40°C @ 95% RH Non-Condensing
Storage Temperature: Storage temperature: -40~85°C
Storage Humidity: Relative humidity: 95% @ 60°C
1.3

Block Diagram

2 x DDR4 SODIMM
2400MHz dual channel
up to 64G
HDMI 1.4 (4k@30Hz)
DP 1.2 (DP++) (4k@60Hz)
2 x GbE
2 x USB 3.1 Gen2
2 x USB 3.1 Gen2
Line-in/Out/MIC
*Function block with dotted line support by request
DDR channel
DDI x1
Mobile CPU
DDI x1
DMI 3.0
PCIe x1
I210
PCIe x1
I219
Intel Cannon Lake
Mobile PCH-H
CM246 (support ECC)
QM370
Audio Codec
SPI
LPC
256MB BIOS
EIO-IS201
COM1 RS-232/422/485
5
eDP
PTN3460
PCIe x 1 (Gen.3)
USB2.0 x 1
M.2 Key E
PCIe x 4 (Gen.3)
SATA III x 1
M.2 Key M
PCIe x 2 (Gen.3)
SATA III x 1
USB2.0 x 1
M.2 Key B
SATA III x 2
2 x SATA III
DDI x 1, PCIe x4,
USB3.0/2.0
MIOe
LPC, SMBUS, Rest,
Line out, Power on
SPI
TPM 2.0
COM2 RS-232/422/485
MIO-5393 User Manual
48-bit LVDS
eDP
(4k@60Hz)
Nano SIM
I2C
SMBus
CAN Bus
2 x 8-bit GPIO

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