IBM BladeCenter HS21 Series Problem Determination And Service Manual page 118

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10. If you are instructed to return the microprocessor and heat sink, follow all
102
BladeCenter HS21 Types 1885 and 8853: Problem Determination and Service Guide
4. If a Memory and I/O Expansion Blade is installed, remove it (see "Removing
an expansion unit" on page 82).
5. Remove the bezel assembly (see "Removing the bezel assembly" on page 84
for instructions).
6. Identify the microprocessor that is to be removed.
Note: If you are replacing a failed microprocessor, make sure that you have
selected the correct microprocessor for replacement (see "Light path
diagnostics" on page 51).
7. Remove the heat sink.
Attention:
Do not touch the thermal material on the bottom of the heat sink.
Touching the thermal material will contaminate it. If the thermal material on the
microprocessor or heat sink becomes contaminated, you must replace the heat
sink.
a. Loosen the screw on one side of the heat sink to break the seal with the
microprocessor.
b. Press firmly on the captive screws and loosen them with a screwdriver.
c. Use your fingers to gently pull the heat sink from the processor.
Attention:
Do not use any tools or sharp objects to lift the release lever on
the microprocessor socket. Doing so might result in permanent damage to the
system board.
Microprocessor
retainer
8. Rotate the locking lever on the microprocessor socket from its closed and
locked position until it stops in the fully open position (approximately a 135°
angle). Lift the microprocessor retainer cover upward.
9. Use your fingers to pull the microprocessor out of the socket.
Microprocessor
Microprossor retainer
packaging instructions, and use any packaging materials for shipping that are
supplied to you.
Microprocessor
release lever
Alignment marks
Microprocessor
socket

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