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Specifications
Thermal characteristics
Rating
Supply Voltage
All Input Voltages
Current Drain per Pin excluding V
Operating Temperature Range:
•
50 and 66 MHz
•
88 MHz
Storage Temperature
THERMAL CHARACTERISTICS
Characteristic
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Thermal characterization parameter
Notes:
1.
Junction-to-ambient thermal resistance is based on measurements on a horizontal-single-sided
Printed Circuit Board per SEMI G38-87 in natural convection.(SEMI is Semiconductor Equipment
and Materials International, 805 East Middlefield Rd., Mountain View, CA 94043, (415) 964-5111)
2.
Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-
88, with the exception that the cold plate temperature is used for the case temperature.
3.
These are measured values. See note 1 for test board conditions.
4.
These are measured values; testing is not complete. Values were measured on a non-standard
four-layer thermal test board (two internal planes) at one watt in a horizontal configuration.
2-2
Freescale Semiconductor, Inc.
Table 2-1 Maximum Ratings (GND = 0 V
and GND
CC
Table 2-2 Thermal Characteristics
Symbol
or θ
1
R
θ JA
or θ
2
R
θ JC
Ψ
JT
DSP56007/D
For More Information On This Product,
Go to: www.freescale.com
)
dc
Symbol
Value
V
–0.3 to +7.0
CC
V
(GND – 0.25) to (V
IN
I
10
T
J
–40 to +125
–40 to +110
T
–55 to +125
STG
3
QFP Value
QFP Value
61.5
JA
11.8
JC
2.7
Unit
V
+ 0.25)
V
CC
mA
° C
° C
° C
4
Unit
˚
37
C/W
˚
—
C/W
˚
—
C/W
MOTOROLA
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