Revision History; Table 10. Document Revision History - ST STM32 Application Note

Thermal management guidelines for applications
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Revision history

Date
24-May-2018
4-Mar-2019
19-Apr-2019
AN5036 - Rev 3
Table 10.
Document revision history
Version
1
Initial release.
Updated:
Title of the document
Section 2.3 Thermal model of a chip carrier
Section 3.3 Ambient temperature versus junction temperature
Section 3.5 Board temperature
2
Section 4 Power dissipation and cooling methods
Added:
Section 3.6 STM32 thermal parameters
Section 6 Thermal analysis example
Updated
Section 3.6 STM32 thermal
3
Added
Section 6.2 Discovery kit with STM32H747XI
Changes
parameters.
MCU.
AN5036
page 23/28

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