Revision history
Date
24-May-2018
4-Mar-2019
19-Apr-2019
AN5036 - Rev 3
Table 10.
Document revision history
Version
1
Initial release.
Updated:
•
Title of the document
•
Section 2.3 Thermal model of a chip carrier
•
Section 3.3 Ambient temperature versus junction temperature
•
Section 3.5 Board temperature
2
•
Section 4 Power dissipation and cooling methods
Added:
•
Section 3.6 STM32 thermal parameters
•
Section 6 Thermal analysis example
Updated
Section 3.6 STM32 thermal
3
Added
Section 6.2 Discovery kit with STM32H747XI
Changes
parameters.
MCU.
AN5036
page 23/28
Need help?
Do you have a question about the STM32 and is the answer not in the manual?