Ic Grounding; Antenna Design; Esd - Silicon Laboratories Z-WAVE 700 Integration Manual

Instruction: Z-Wave 700 Integration Guide
9.6

IC GROUNDING

QFN chips should be provided with a ground paddle with stitched-vias to minimize parasitic inductance and to provide a good
thermal heat sink as shown in Figure 9.9.

10 ANTENNA DESIGN

Since antenna design is very product dependent, it is mandatory to perform the antenna matching as described in Section 8.2.
Each product requires an individual antenna design for best power transfer and radiation characteristics.
At the BRD4202A radio board an example antenna design is shown with a naturally matched antenna not requiring any lumped
components.

11 ESD

Since ESD can destroy the Z-Wave 700 product, great care must be taken during manufacturing and assembly of final goods to
avoid ESD.
By design, all pins of EFR32ZG14 and ZGM130S are ESD protected up to a level of 2.5 kV HBM.
The ESD level of a SAW filter is typically << 2 kV HBM.
INS14487-3 | 2/2019
Figure 9.9: IC ground paddle
EFR32ZG14
Applicable
EFR32ZG14
Applicable
Via
ZGM130S
Applicable
ZGM130S
Applicable
13