Decoupling; For Zgm130S End Device Sip; For Efr32Zg14 Gateway Soc - Silicon Laboratories Z-WAVE 700 Integration Manual

Instruction: Z-Wave 700 Integration Guide
9.4

DECOUPLING

Power should be driven through decoupling capacitors to prevent parasitic inductances as shown in Figure 9.4. At least two
grounding vias is recommended for each component as shown in Figure 9.3.
Power in
Low value capacitors
Figure 9.3: Grounded components

9.4.1 FOR ZGM130S END DEVICE SIP

For the ZGM130S, most of the decoupling is built in. This includes all supply decoupling except for two 10 µF capacitors, one on
AVDD and one on VDD and VDDIO combined.

9.4.2 FOR EFR32ZG14 GATEWAY SOC

For Z-Wave 700 devices with only the digital supply, the filter shown in Figure 9.6 is strongly recommended.
INS14487-3 | 2/2019
Main supply
Consumer #2
Consumer #1
Figure 9.2: Star topology power routing
Power out
High value capacitors
Figure 9.5: Recommended external supply decoupling for the ZGM130S
Root of star
Consumer #3
Via
Figure 9.4: Pin decoupling
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