Silicon Laboratories Z-WAVE 700 Integration Manual

INSTRUCTION:
INTEGRATION GUIDE FOR SILICON LABS ZENGECKO Z-WAVE® DEVICES
The purpose of this document is to provide an implementation guide for integrating Z-Wave 700 devices into product designs.
It is intended for product design engineers who aim for a fast integration of Z-Wave 700 devices.
1

OVERVIEW

The Z-Wave 700 device portfolio is shown in Table 1.1. The EFR32ZG14 gateway SoC exposes the Z-Wave serial API via UART and
is dedicated to gateway applications. The ZGM130S SiP module combines a general-purpose SoC, crystal, supply decoupling
components, and RF matching components into a single small-footprint module requiring only two decoupling capacitors. The
ZGM130S is targeted at end device applications and, with its built-in ARM M4 core and ultra-low power consumption, it is perfect
for making single chip sensors and other end devices that require advanced processing and low power consumption.
Type
Chip
Module
The applicable modules are clearly stated at the beginning of each of the following sections.
INS14487-3 | 2/2019
Z-Wave 700 Integration Guide
Table 1.1: Z-Wave 700 device portfolio
QFN32
SoC
5mm x 5mm
EFR32ZG14
LGA64
SiP
9mm x 9mm
ZGM130S
1