Thermal Alarm; Dealing With Hardware Faults; Continuous Operation During Replacement; Firmware Updates - Lenovo Storage D1212 Hardware Installation And Maintenance Manual

Thermal Alarm

Symptom
1. Ops panel module
fault LED is amber.

Dealing with Hardware Faults

Ensure that you have obtained a replacement module of the same type before removing any faulty module.
Important: If the enclosure system is powered up and you remove any module, replace it immediately. If the
system is used with any modules missing for more than a few seconds, the enclosure can overheat, causing
power failure and data loss. Such action will invalidate the warranty.
Important: Observe all conventional ESD precautions when handling modules and components. Avoid
contact with midplane components and module connectors, etc.

Continuous Operation During Replacement

Your hardware or software enclosure management application determines the capability of replacing a failed
disk without loss of access to any file system on the enclosure. Enclosure access and use during this period
is uninterrupted when appropriate I/O or management connectivity set up prior.
If an enclosure contains two or more PCMs or PSUs, they can maintain power to the system while a faulty
PCM or a faulty PSU is replaced.

Firmware Updates

Periodically, firmware updates to ESMs, PCMs, PSUs, FANs and midplanes may be necessary. This is
accomplished through a combined update software package.

PCM or PSU Firmware Programming Failure

If a PCM's or PSU's firmware is being programmed and the download fails, the PCM fans or PSU fans go to
full speed and the PCM LEDs or PSU LEDs flash.
Important: In this situation (where PCM or PSU programming has failed) the PCM or PSU can be
reprogrammed but it must not be moved between bays. If the PCM or PSU is moved, it must be returned to
the original bay before reprogramming can occur.
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Lenovo Storage D1212/D1224/D3284Hardware Installation and Maintenance Guide
Cause
The internal temperature has
exceeded a pre-set threshold.
Action
1. Check that the local ambient environment
temperature is below the specification (see
"Environment" on page 113).
2. Check the installation for any airflow restrictions at
either the front or rear of the enclosure. A minimum
gap of 25 mm at the front and 50 mm at the rear is
recommended.
3. Check for restrictions due to dust buildup. Clean as
appropriate.
4. Check for excessive recirculation of heated air from
rear to the front. Use of the enclosure in a fully
enclosed rack is not recommended.
5. If possible, shut down the enclosure and investigate
the problem before continuing.