Mechanical Data; Packaging; Pin Assignment - Intel 80960KB Manual

3.0

MECHANICAL DATA

3.1

Packaging

The 80960KB is available in two package types:
• 132-lead ceramic pin-grid array (PGA). Pins are
arranged 0.100 inch (2.54 mm) center-to-center, in
a 14 by 14 matrix, three rows around (see Figure
17).
• 132-lead plastic quad flat pack (PQFP). This
package uses fine-pitch gull wing leads arranged
in a single row along the package perimeter with
0.025 inch (0.64 mm) spacing (see Figure 20).
Dimensions for both package types are given in the
Intel Packaging handbook (Order #240800).
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A B C D E F G H J K
Figure 17. 132-Lead Pin-Grid Array (PGA) Package
3.1.1

Pin Assignment

The PGA and PQFP have different pin assignments.
Figure 18 shows the view from the PGA bottom (pins
facing up) and Figure 19 shows a view from the PGA
top (pins facing down). Figure 20 shows the PQFP
package; Figure 21 shows the PQFP pinout with
signal names. Notice that the pins are numbered in
order from 1 to 132 around the package perimeter.
Table 10 and Table 11 list the function of each PGA
pin; Table 12 and Table 13 list the function of each
PQFP pin.
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80960KB
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