Fluke 93 Service Manual page 5

CONTENTS
V
5.
CALIBRATION ADJUSTMENT PROCEDURE
5-1
5.1
GENERAL
INFORMATION
5-1
5.2
RECOMMENDED
CALIBRATION
ADJUSTMENT EQUIPMENT
5-1
5.3
ENTERING THE
CALIBRATION
PROCEDURE
5-2
5.4
OPERATING THE CAUBRATION PROCEDURE
5-3
5.5
CONTRAST
CALIBRATION
ADJUSTMENT PROCEDURE
5-4
5.6
SCOPE
CALIBRATION
ADJUSTMENT PROCEDURE
5-4
5.6.1
HARDWARE SCOPE
CAUBRATION ADJUSTMENTS
5-4
5.6.2
CLOSED CASE SCOPE
CALIBRATION ADJUSTMENTS
5-8
5.7
METER CAUBRATION ADJUSTMENT
PROCEDURE
5-15
5.8
CALIBRATION
ADJUSTMENT PROCEDURE
SUMMARY
5-24
6.
DISASSEMBLING THE SCOPEMETER
6-1
6.1
GENERAL
INFORMATION
6-1
6.2.
DISASSEMBLY PROCEDURE
6-1
6.2.1
REMOVING THE
BATTERY PACK
6-2
6.2.2
OPENING THE SCOPEMETER
6-2
6.2.3
REMOVING THE ANALOG
A2
PCB.
TO ENABLE HARDWARE
SCOPE
CAUBRATION ADJUSTMENTS
6-4
6.2.4
REMOVING THE
DIGITAL A1
PCB
6-4
7.
CORRECTIVE MAINTENANCE
7-1
7,1
DIAGNOSTIC TESTING AND TROUBLESHOOTING
7-1
7.1.1
INTRODUCTION
7-1
7.1.2
TROUBLESHOOTING TECHNIQUES
7-1
7.1.3
DISPLAY
AND ERROR MESSAGES
7-2
7.1.4
MAIN
TESTS
7-5
7.1.5
TROUBLESHOOTING
7-7
7.1.6
DIGITAL At
PCB TROUBLESHOOTING
7-7
7.1.7
ANALOG
A2
PCB TROUBLESHOOTING
7-28
72 REPLACEMB^TS
7-40
7.2.1
STANDARD
PARTS
7-40
7.2.2
SPECIAL PARTS
7-40
7.2.3
TRANSISTORS AND
INTEGRATED
CIRCUITS
7-40
7.2.4
STATIC -SENSITIVE
COMPONENTS
7-40
7.2.5
REPLACEMENT OF
PARTS
7-42
7.3
SOLDERING TECHNIQUES
7.5I
7-3-1
GENERAL
SOLDERING TECHNIQUES
7-51
7.3.2
SOLDERING
MICRO-MINIATURE SEMICONDUCTORS
7-51