Thermal Solutions; Performance Targets; Boundary Conditions And Performance Targets - Intel Xeon 5500 Series Design Manual

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Thermal Solutions

5
Thermal Solutions
This section describes a 1U reference heatsink, design targets for 2U and Tower
heatsinks, performance expectations for a 25.5 mm tall heatsink, and thermal design
guidelines for Intel® Xeon® Processor 5500 Series and the follow-on processors.
5.1

Performance Targets

Table 5-1
heatsinks. These values are used to generate processor thermal specifications and to
provide guidance for heatsink design.
Table 5-1.

Boundary Conditions and Performance Targets

Parameter
Altitude, system
ambient temp
TDP
1
T
LA
Ψ
2
CA
3
Airflow
System height
(form factor)
Heatsink
volumetric
Heatsink
technology
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter
3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H
4. Reference system configuration. Processor is downstream from memory in EEB (Entry-Level Electronics Bay).
Ducting is utilized to direct airflow.
5. The 1U heatsink can also meet Profile B for the 95W processor in TEB (Thin Electronics Bay) under the
following conditions: TLA = 40ºC, ΨCA = 0.275ºC/W, airflow = 16 CFM @ 0.344" dP (these TEB values are
not used to generate processor thermal specifications). Processor is not downstream from memory in TEB.
Ducting is utilized to direct airflow.
6. Dimensions of heatsink do not include socket or processor.
7. The 2U heatsink height (64mm) + socket/processor height (7.729 mm,
max height for EEB monoplanar boards (http://ssiforum.oaktree.com/).
8. Passive heatsinks. PCM45F thermal interface material.
9. WS = Workstation.
Thermal/Mechanical Design Guide
provides boundary conditions and performance targets for 1U, 2U and Tower
60W
80W
o
o
49
C
49
o
0.335
C/W
0.336
9.7 CFM @
9.7 CFM @
0.20" dP
0.20" dP
1U (EEB)
1U (EEB)
4
90 x 90 x 27mm (1U)
Cu base, Al fins
8
Value
o
Sea level, 35
95W, Profile B
o
C
49
C
o
o
C/W
0.337
C/W
9.7 CFM @
0.20" dP
5
1U (EEB)
6
C
95W, Profile A
130W, WS
o
o
55
C
40
C
o
o
0.201
C/W
0.201
30 CFM @
30 CFM @
0.205" dP
0.205" dP
2U (EEB)
Pedestal (EEB)
90 x 90 x 64mm
90 x 90 x 99mm
6,7
(2U)
(Tower)
Cu/Al base, Al fins with heatpipes
(Section
5.5.1).
Table
4-2) complies with 76.2 mm
9
C/W
6
O.
2
31

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