Connection Of Equipotential Bonding - Siemens SIMATIC IPC847D Operating Instructions Manual

I/O devices
NOTICE
Fault caused by I/O devices
The connection of I/O devices can cause faults in the device. The result may be personal
injury and damage to the machine or plant. Note the following:
• Connect only I/O devices which are approved for industrial applications in accordance
• Peripheral devices that are incapable of hot-plugging may only be connected after the
Damage through regenerative feedback
Regenerative feedback of voltage to ground by a connected or installed component can
damage the device.
Connected or built-in I/Os, for example, a USB drive, are not permitted to supply any
voltage to the device. Regenerative feedback is generally not permitted.
3.3.2

Connection of equipotential bonding

A low-impedance ground connection improves the discharge of interference generated by
external power cables, signal cables or cables for I/O modules to ground.
This equipotential bonding connection has the following properties:
● large surface
● large surface area contacts
● M4 thread
● Symbol on the device:
Requirement
● TORX T20 screwdriver
Procedure
1. Connect the equipotential bonding connection
device with the central ground of the control cabinet or the
plant in which the device is installed. The minimum cross-
section of the equipotential bonding cable may not be less
than 2.5 mm
SIMATIC IPC847D
Operating Instructions, 01/2014, A5E32997454-AA
with EN 61000-6-2/IEC 61000-6-2.
device has been disconnected from the power supply.
.
2
Installing and connecting the device
3.3 Connecting the device
①
on the
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