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6.
REPAIR PROCEDURES
6.1.
Introduction
This section describes the equipment and software required to test and calibrate the phone.
Calibration Procedures are described in Section 8.
The handset can be connected to a compatible personal computer for electronic adjustment and fault diagnosis. This section
provides a description of the equipment required to perform those tasks.
Prior to testing and adjustment, the unit should first be disassembled, as detailed in Section 6, and then the PCB connected to
the PCB Repair Jig. Fault tracing can be performed on the PCB using suitable test equipment, such as spectrum analysers
and oscilloscopes.
The unit must be tested and calibrated for all frequency bands (900 MHz, 1800 MHz and 1900 MHz).
6.2.
Underfill Resin Paste
A Naphthalene-based resin paste is used to bond underfill components on this phone. When heated, this paste may give
off traces of Naphthalene.
Therefore, it is recommended that work on the PCB be carried out in a well-ventilated area, especially when using hot air
blowers or soldering irons.
The following components are bonded using the paste:.
OMAP310 (U200)
S-Gold (U100)
Bluetooth IC (U201)
6.3.
Lead Free (Pdf) solder
The Printed Circuit Board (PCB) used in this telephone has been manufactured using Lead Free solder.
Lead Free solder has a higher melting point than Lead solder - typically 30 - 40 ˚C higher. Always use a high temperature
soldering iron When using a soldering iron with temperature control, it should be set to 370 ±10 ˚C (700 ± 20˚F).
When using lead solder, all PbF solder must be removed from the solder area. Where this is not possible, heat the PbF
solder until it melts before applying lead solder.
Avoid overheating PbF solder as it has a tendency to splash at temperatures above 600 ˚C (1100 ˚F).
PROVISIONAL ISSUE
WARNING
Caution
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