Repair Procedures; Introduction; Lead Free (Pbf) Solder; External Testing - Panasonic EB-X100 Service Manual

Personal cellular telephone
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7. REPAIR PROCEDURES

7.1. Introduction

This section provides information on testing the telephone. The layout is as follows:
Section 7.2. : Lead Free (PbF) solder: Identification and repair of PCBs using PbF solder.
Section 7.3. : External testing: describes equipment requirements and general set up procedure.
Section 7.4. : Complete Unit Test Setup: Describes how the items of test equipment are used together and general set up
procedure.
Adjustment Procedures are described in Section 8.

7.2. Lead Free (PbF) Solder

The Printed Circuit Board (PCB) used in this telephone has been manufactured using Lead Free solder.
(SPARKLE ECO SOLDER : Part No. ESC F3 M705 0.3)
Lead Free solder has a higher melting point than Lead solder - typically 30 - 40 °C higher. Always use a high temperature soldering iron
When using a soldering iron with temperature control, it should be set to 370 ± 10 °C (700 ± 20 °F).
When using lead solder, all PbF solder must be removed from the solder area. Where this is not possible, heat the PbF solder until it
melts before applying lead solder.
Avoid overheating PbF solder as it has a tendency to splash at temperatures above 600 °C (1100 °F).

7.3. External Testing

7.3.1. General Information

The handset can be connected to a compatible personal computer for electronic adjustment and fault diagnosis. This section
provides a description of the equipment required to perform those tasks.
Prior to testing and adjustment, the unit should first be disassembled, as detailed in Section 6, and then the PCB connected to
the PCB Repair Jig. Fault tracing can be performed on the PCB using suitable test equipment, such as spectrum analysers
and oscilloscopes.
The unit must be tested and calibrated for all frequency bands (900 MHz and 1800 MHz).
Personal Computer (PC)
The PC (IBM compatible) is used as a Unit Under Test controller. This, in conjunction with the channel box software, allows all
of the test facilities normally provided through the Keypad of the Unit Under Test.
The Microsoft Windows
®
A Universal Serial Bus (USB) port must be installed on the PC if automatic RF calibration is to performed.
Power Supply
A power supply is required to provide to the PCB via the PCB Repair Jig while a second unit is required to provide power
baseband calibration and unit testing.
, 98SE, 2000 or XP operating system must be installed on the PC.
CAUTION
– 7-1 –

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