Environmental Requirements - Pace MBT250 Operation & Maintenance Manual

Actual minimum and maximum Operating Tip Temperatures may vary
EOS/ESD
Tip-To-GroundResistance:
AC Leakage:

ENVIRONMENTAL REQUIREMENTS

Ambient Operating Temperature: 0°C to 50°C (32°F to 120°F)
Storage Temperature:
Capabilities
All capabilities are dependent upon the use of the appropriate Functional Accessories or Work Aids (refer to Basic
Operation section). Available SensaTemp handpieces and their associated assembly and repair functions are listed
below. An Operations and Maintenance Manual is provided separately with each handpiece which describes the
applications and recommended procedures for that particular tool.
PS-90 Soldering Iron - Provides a wide range of SMD and thru-hole installation and removal capability as well as
unsurpassed thermal performance on heavy, multilayer thru-hole assemblies at safe, lower working temperatures.
A wide variety of 3/16" shank, quick change thru-hole and SMD tips (for chip components, SOTs, SOICs and
other components) are available.
SX-80 Sodr-X-Tractor handpiece - Air handpiece ideal for thru-hole desoldering on extra high mass multilayer
boards. Also ideal for removal of TSOP & TQFP surface mount components and for "Flo" desoldering during
surface mount land preparation.
TT-65 ThermoTweez handpiece - Performs removal of PLCC (J Leaded), LCCC (leadless) and other surface mount
devices.
TP-65 ThermoPik handpiece - Air handpiece performs removal of Flat Pack, QFP & PQFP surface mount devices.
DTP-80 Dual ThermoPik handpiece - Air handpiece performs removal of large Flat Pack, QFP, PQFP & BGA surface
mount devices.
TJ-70 Mini ThermoJet handpiece - Air handpiece. Focused hot air reflow handpiece used for installation of all
types of surface mount devices.
GENERAL INFORMATION
NOTE
depending on handpiece & tip selection.
Less than 5 ohms (except on Soft Ground Systems).
Less than 2 millivolts RMS from 50Hz to 500Hz
(except on Soft Ground Systems).
-40°C to 100°C (-40°F to 212°F)
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