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About This Manual
Term/Acronym
Media Expansion
Card
Pad
Pillar Rock
Pin
Silver Cascade
System Bus
System
Management Bus
VCC (CPU core)
Table 3
defines the acronyms used throughout this document.
Table 3. Acronyms
Acronym
AC
ACPI
ADD2
ADD2N
AGTL or AGTL+
AMI
AMPS or iAMPS
AMT or iAMT
ATA
ATX
BGA
BIOS
BSEL
CL
CMOS
COM
CPU
Development Kit User's Manual
The Media Expansion Card (MEC) provides digital display options through
the SDVO interface. The MEC card also incorporates video-in via a x1 PCI
Express* port.
The electrical contact point of a semiconductor die to the package
substrate. A pad is only observable in simulations.
The name of the development board that uses Intel
processor with the Mobile Intel GM45 Express Chipset and DDR2 SDRAM
The contact point of a component package to the traces on a substrate,
such as the motherboard. Signal quality and timings may be measured at
the pin.
The name of the development board that uses Intel
processor with the Mobile Intel GM45 Express Chipset and DDR3 SDRAM
The System Bus is the microprocessor bus of the processor.
A two-wire interface through which various system components may
communicate.
VCC (CPU core) is the core power for the processor. The system bus is
terminated to VCC (CPU core).
Alternating Current
Advanced Configuration and Power Interface
Advanced Digital Display 2
Advanced Digital Display 2 Normal
Assisted Gunning Transceiver Logic (See also Table 2 above)
American Megatrends Inc. (BIOS developer)
(Intel) Adaptive Mobile Power System
(Intel) Active Management Technology
Advanced Technology Attachment (disk drive interface)
Advance Technology Extended (motherboard form factor)
Ball Grid Array
Basic Input/Output System
Bus Select (Front Side Bus frequency control signals)
Controller Link
Complementary Metal-Oxide-Semiconductor
Communications
Central Processing Unit (processor)
Definition
Core™ 2 Duo
®
Core™ 2 Duo
®
Definition
11
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