EPOX EP-6VBA User Manual page 9

EP-6VBA
The entire enclosed product is called the Pentium
The packaging technology and each of the physical elements of the product are
referred to using accurate technical descriptions. This allows clear reference to
the products as just a processor. This is the model used in past packaging tech-
nologies like PGA, TCP, PQFP, DIP, etc.
®
• Pentium II or Pentium
The new enclosed card packaging technology is called a "Single Edge
Contact cartridge." This is similar to previous names for packaging
technology such as PGA or TCP.
• Processor card
The green PCB (with or without components on it)
• Processor core
The silicon on the PLGA package on the PCB
• Cover
The plastic cover on the opposite side from the thermal plate.
• Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium
processor uses Socket 8.
• Retention mechanism
Formerly 'retention module' the dual posts, etc. that holds the cartridge in
place.
• Thermal plate
The heatsink attachment plate.
• Heat sink supports
The support pieces that are mounted on the mainboard to provide added
support for heatsinks.
Cover
®
III Processor
Thermal Plate
Processor
Printed Circuit Board
Introduction
®
II or Pentium
Figure 1:
®
Pentium II or Pentium
CPU with S.E.C. Cartridge
®
III Processor.
®
Pro
®
III Processor
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