MiTAC 8050QMA Service Manual page 88

5.1 Intel 915PM North Bridge(10)
Power and Ground
Interface Ball Name Description
Host VTT (VCCP) FSB power supply (1.05 V) - (VCCP)
DRAM VCCA_SM VCCASM is the Analog power supply for SM data buffers used for
DLL & other logic (1.5 V)
VCCSM System memory power supply (DDR=2.5 V; DDR2=1.8 V)
PCI Express VCC3G PCI Express / DMI Analog power supply (1.5 V)
Based
VCCA_3GBG PCI Express / DMI band gap power supply (2.5 V)
Graphics /DMI
VSSA_3GBG PCI Express / DMI band gap ground
PLL Analog VCCA_HPLL Power supply for the Host VCO in the host/mem/core PLL (1.5 V)
VCCA_MPLL Power supply for the mem VCO in the host/mem/core PLL (1.5 V)
VCCD_HMPL Power Supply for the digital dividers in the HMPLL (1.5 V)
L
VCCA_3GPLL Power supply for the 3GIO PLL (1.5 V)
VCCA_DPLL Display A PLL power supply (1.5 V)
A
VCCA_DPLL Display B PLL power supply (1.5 V)
B
High Voltage VCCHV Power supply for the HV buffers (2.5 V)
Interfaces
CRT DAC VCCA_CRTD Analog power supply for the DAC (2.5 V)
AC
VSSA_CRTD Analog ground for the DAC
AC
VCC_SYNC Power supply for HSYNC/ VSYNC (2.5 V)
LVDS VCCD_LVDS Digital power supply (1.5 V)
VCCTX_LVD Data/Clk Tx power supply (2.5 V)
S
VCCA_LVDS LVDS analog power supply (2.5 V)
VSSALVDS LVDS analog VSS
80 50QMA N/B Maintenance
80 50QMA N/B Maintenance
Power and Ground (Continued)
Interface Ball Name Description
TVDAC VCCA_TVBG TV DAC Band Gap Power (3.3 V)
VSSA_TVBG TV DAC Band Gap VSS
VCCD_TVDA Dedicated Power Supply for TVDAC (1.5 V)
C
VCCDQ_TVD Power Supply for Digital Quiet TVDAC (1.5 V)
AC
VCCA_TVDA Power Supply for TV Out Channel A (3.3 V)
CA
VCCA_TVDA Power Supply for TV Out Channel B (3.3 V)
CB
VCCA_TVDA Power Supply for TV Out Channel C (3.3 V)
CC
Core VCC Core VCC – (1.05 V or 1.5 V)
Ground VSS Ground
NCTF
Non-Critical To Function power signals:
"NCTF" (Non-Critical To Function) have been designed into the package footprint
to enhance the Solder Joint Reliability of our products by absorbing some of the
stress introduced by the Characteristic Thermal Expansion (CTE) mismatch of the
Die to package interface. It is expected that in some cases, these balls may crack
partially or completely, however, this will have no impact to our product
performance or reliability. Intel has added these balls primarily to serve as sacrificial
stress absorbers.
NOTE: Signals do not exist in Intel 915GMS.
VTT_NCTF NCTF FSB power supply (1.05 V or 1.2 V)
VCC_NCTF NTCF Core VCC – (1.05 V or 1.5 V)
VCCSM_NCT NTCF System memory power supply (DDR=2.5 V; DDR2=1.8 V)
F
VSS_NCTF NTCF Ground
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