Compaq 6530b - Notebook PC Maintenance And Service Manual page 81

4. Remove the heat sink (2) by sliding it to the right.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Thermal pads are used on the
Northbridge chip (1) and the section of the heat sink (1) that services it. Thermal paste is used on
the processor (2) and the section of the heat sink (2) that services it. Replacement thermal material
is included with all heat sink, system board, and processor spare part kits.
NOTE: Steps 5 through 8 apply only to HP Compaq 6535b computer models. See steps 1 through
4 for removing the heat sink on HP Compaq 6530b computer models.
5. Remove the two Phillips PM2.0×4.0 screws (1) that secure the heat sink clips to the heat sink.
Component replacement procedures 71