Server I/O Lid And Modules - HP DL760 - ProLiant - 1 GB RAM User Manual

Server Access

Server I/O Lid and Modules

The ProLiant DL760 G2 server chassis facilitates the installation of hardware
upgrades through the use of three removable modules and a sliding I/O lid. The
following table describes the contents of the modules and how to access the
components.
Table 3-1: Module and Bay Components and Access
Module
I/O module with system fans
Processor and memory
module
Media module
The following sections provide instructions for removing the processor and memory
module, media module, and I/O module. For information pertaining to PCI Hot Plug
and hot-plug fan access, refer to Chapter 5.
CAUTION: Do not attempt to remove any of the three modules while power is
applied to the system. They are not hot-pluggable. Immediate system shutdown and
data loss will occur.
3-2
Contents
PCI Hot Plug expansion slots
Configuration switches
Hot-plug fans 1 and 2
Processor sockets
Memory (DIMMs)
CD-ROM/
Diskette/IMD
Hot-plug hard drives
HP ProLiant DL760 Generation 2 Server User Guide
Access Method
Slide the I/O lid toward the
front of the server.
Slide the I/O lid toward the
front of the server.
Slide the I/O lid toward the
front of the server.
Remove the processor and
memory module and the
processor board.
Remove the memory cartridge.
Access directly at the front of
the server.
Access directly at the front of
the server.