Environmental Requirements; Electrical Requirements For Lga1366 Socket - Intel X5550 - Quad Core Xeon Design Manual

LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications
Table 4-4.

Electrical Requirements for LGA1366 Socket

Mated loop inductance, Loop
Mated partial mutual inductance, L
Maximum mutual capacitance, C.
Socket Average Contact Resistance
(EOL)
Max Individual Contact Resistance
(EOL)
Bulk Resistance Increase
Dielectric Withstand Voltage
Insulation Resistance
4.6

Environmental Requirements

Design, including materials, shall be consistent with the manufacture of units that meet
the following environmental reference points.
The reliability targets in this chapter are based on the expected field use environment
for these products. The test sequence for new sockets will be developed using the
knowledge-based reliability evaluation methodology, which is acceleration factor
dependent. A simplified process flow of this methodology can be seen in
Thermal/Mechanical Design Guide
Parameter
360 Volts RMS
Value
The inductance calculated for two contacts,
considering one forward conductor and one return
<3.9nH
conductor. These values must be satisfied at the
worst-case height of the socket.
The inductance on a contact due to any single
NA
neighboring contact.
<1 pF The capacitance between two contacts
The socket average contact resistance target is
derived from average of every chain contact
resistance for each part used in testing, with a
chain contact resistance defined as the resistance
of each chain minus resistance of shorting bars
divided by number of lands in the daisy chain.
15.2 m
The specification listed is at room temperature
and has to be satisfied at all time.
Socket Contact Resistance: The resistance of
the socket contact, solderball, and interface
resistance to the interposer land.
The specification listed is at room temperature
and has to be satisfied at all time.
100 m
Socket Contact Resistance: The resistance of
the socket contact, solderball, and interface
resistance to the interposer land; gaps included.
The bulk resistance increase per contact from
3 m
24 °C to 107 °C
800 M
Comment
Figure 4-1.
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