Contacts; Pick And Place Cover - Intel X5550 - Quad Core Xeon Design Manual

LGA1366 Socket
compatible with immersion silver (ImAg) motherboard surface finish and a SAC
alloy solder paste.
The co-planarity (profile) and true position requirements are defined in
2.3.3

Contacts

Base material for the contacts is high strength copper alloy.
For the area on socket contacts where processor lands will mate, there is a 0.381 m
[15 inches] minimum gold plating over 1.27 m [50 inches] minimum nickel
underplate.
No contamination by solder in the contact area is allowed during solder reflow.
2.3.4

Pick and Place Cover

The cover provides a planar surface for vacuum pick up used to place components in
the Surface Mount Technology (SMT) manufacturing line. The cover remains on the
socket during reflow to help prevent contamination during reflow. The cover can
withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions
listed in the LGA1366 Socket Validation Reports without degrading.
As indicated in
should remain on whenever possible to help prevent damage to the socket contacts.
Cover retention must be sufficient to support the socket weight during lifting,
translation, and placement (board manufacturing), and during board and system
shipping and handling.
The covers are designed to be interchangeable between socket suppliers. As indicated
in Figure
orientation with the socket.
See LGA1366_Socket_Pick_and_Place_Removal_Tool_rev2.0 for a drawing of a tool
designed to provide mechanical assistance during cover installation and removal.
Figure 2-5.

Pick and Place Cover

Thermal/Mechanical Design Guide
Figure 2-5, the cover remains on the socket during ILM installation, and
2-5, a Pin1 indicator on the cover provides a visual reference for proper
Appendix C.
17