Lga1366 Socket Nctf Solder Joints; Lga1366 Nctf Solder Joints - Intel X5550 - Quad Core Xeon Design Manual

Xeon processor 5500/5600 series thermal/mechanical design guide
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2.9

LGA1366 Socket NCTF Solder Joints

Intel has defined selected solder joints of the socket as non-critical to function (NCTF)
for post environmental testing. The processor signals at NCTF locations are typically
redundant ground or non-critical reserved, so the loss of the solder joint continuity at
end of life conditions will not affect the overall product functionality.
identifies the NCTF solder joints.
.
Figure 2-7.

LGA1366 NCTF Solder Joints

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Note:
For platforms supporting the DP processor land C3 is CTF.
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§
LGA1366 Socket
Figure 2-7
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Thermal/Mechanical Design Guide

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