Table of Contents
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Chapter 1: Introduction
Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, please check the chas-
sis and heatsink specifications.
Note 2: For BMC configuration instructions, please refer to the Embedded BMC Con-
figuration User's Guide available at https://www.supermicro.com/support/manuals/.
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