Supermicro X13DAI-T User Manual page 15

Motherboard Features
CPU
•
Supports dual 5th/4th Gen. Intel Xeon Scalable Processors (in Socket E LGA 4677) with four UPIs (20 GT/s max.), up
to 64 CPU cores, and a thermal design power (TDP) of up to 350 W.
Note: Be sure to use processors of the same SKU on a multi-processor motherboard.
Memory
•
Supports up to 4TB 3DS RDIMM/RDIMM DDR5 (288-pin) ECC memory with speeds of up to 5600 MT/s (1DPC) in 16
DIMM slots.
Note: Memory speed and capacity support depends on the processor.
DIMM Size
•
Up to 256GB at 1.1V
Note: For the latest CPU/memory updates, please refer to our website at
motherboard.
Chipset
•
Intel C741
Expansion Slots
•
Five PCIe 5.0 x16/CXL slots (CPU1 SLOT1/3/5, CPU2 SLOT2/4)
•
One PCIe 5.0 x8/CXL slot (CPU2 SLOT6)
•
Two PCIe 5.0 x8 MCIO NVMe connectors with support of four connections (P1_NVME0/1, P2_NVME0/1)
•
Two PCIe 5.0 NVMe M.2 slots (support M-Key 2280 and 22110)
Baseboard Management Controller (BMC)/Network
•
ASPEED AST2600 BMC (shared LAN) with RoT 2.0
•
Two 10GbE LAN ports supported by Broadcom BCM57416 controller
Graphics
•
Graphics controller and VGA support via ASPEED AST2600 BMC
I/O Devices
•
One front accessible COM header (COM1)
•
One SlimSAS LP connector (JS1: SATA0~7) with support of eight Intel PCH SATA 3.0 connections (RAID 0, RAID 1,
RAID 5, and RAID 10 supported); Two Intel PCH powered SATA 3.0 connectors with support of SuperDOM devices
(I-SATA8 and I-SATA9)
•
One VGA port on the rear I/O panel
Peripheral Devices
•
One front-accessible USB 2.0 header with support of two connections (USB0/1)
•
Four USB 3.0 ports on the rear I/O panel (USB2/3/4/5)
•
One front-accessible USB 3.0 header with support of two connections (USB6/7)
•
One internal USB 3.1 Gen 2 connector (USB8)
Motherboard Features
15
Chapter 1: Introduction
https://www.supermicro.com/products/