Packaging Specification - Quectel SC262R Series Hardware Design

Table 49: Recommended Thermal Profile Parameters
Factor
Soak Zone
Max slope
Soak time (between A and B: 150 ° C and 200 ° C)
Reflow Zone
Max slope
Reflow time (D: over 217 ° C)
Max temperature
Cooling down slope
Reflow Cycle
Max reflow cycle
NOTE
1. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
2. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for
any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic
soldering) that is not mentioned in document [4].

9.3. Packaging Specification

This chapter describes only the key parameters and process of packaging. All figures below are for
reference only. The appearance and structure of the packaging materials are subject to the actual
delivery.
The module adopts carrier tape packaging and details are as follow:
SC262R_Series_Hardware_Design
Recommendation
1–3 ° C/s
70–120 s
1–3 ° C/s
40–70 s
235 ° C to 246 ° C
-1.5 to -3 ° C/s
1
Smart Module Series
105 / 115