Quectel SC262R Series Hardware Design page 12

Smart Module Series
Figure 42: Bottom Dimension (Bottom View) ........................................................................................... 100
Figure 43: Recommended Footprint (Top View) ...................................................................................... 101
Figure 44: Top and Bottom Views of the Module ..................................................................................... 102
Figure 45: Recommended Reflow Soldering Thermal Profile ................................................................. 104
Figure 46: Carrier Tape Dimension Drawing ............................................................................................ 106
Figure 47: Plastic Reel Dimension Drawing ............................................................................................ 106
Figure 48: Packaging Process ................................................................................................................. 107
SC262R_Series_Hardware_Design 11 / 115