Table of Contents
1 High-Density EVM Description..............................................................................................................................................
Applications............................................................................................................................................................3
Procedure......................................................................................................................................................4
2.1 EVM Connections..............................................................................................................................................................
2.2 EVM Setup.........................................................................................................................................................................
2.3 Test Equipment..................................................................................................................................................................
Setup.................................................................................................................................................6
2.5 Test Procedure...................................................................................................................................................................
3.2 Waveforms.........................................................................................................................................................................
Plot............................................................................................................................................................................9
Performance..............................................................................................................................................................11
Documentation.............................................................................................................................................................12
4.1 Schematic........................................................................................................................................................................
Materials.................................................................................................................................................................13
4.3 PCB Layout......................................................................................................................................................................
4.4 Multi-Layer Stackup.........................................................................................................................................................
Support.................................................................................................................................................................17
5.2 Documentation Support...................................................................................................................................................
Setup.........................................................................................................................................................4
OUT
= 24 V...............................................................................................................................................
IN
Figure 3-6. Shutdown .................................................................................................................................................................
Figure 3-10. Infrared Thermal Image V
Schematic.......................................................................................................................................................12
Figure 4-2. 3D Top View............................................................................................................................................................
View.......................................................................................................................................................14
Copper....................................................................................................................................................15
Copper........................................................................................................................................................15
Copper........................................................................................................................................................16
Figure 4-8. Layer Stackup.........................................................................................................................................................
Table 2-1. EVM Power Connections............................................................................................................................................
Table 2-2. EVM Signal Connections............................................................................................................................................
Table 4-1. Component BOM......................................................................................................................................................
Trademarks
HotRod
™
is a trademark of Texas Instruments.
®
is a registered trademark of Texas Instruments.
All trademarks are the property of their respective owners.
2
TLVM13610EVM Buck Regulator Evaluation Module
Table of Contents
Support...................................................................................................................................17
List of Figures
= 5 V, F
= 1 MHz, AUTO Mode........................................................................................
OUT
SW
= 3.3 V, F
= 1 MHz, AUTO Mode................................................................................................
SW
= 3.3 V, F
= 1 MHz, AUTO Mode.....................................................................................
OUT
SW
.................................................................................................................................................8
A/µs..........................................................................................................................8
= 12 V, V
= 5 V........................................................................................................
IN
= 5 V......................................................................................................
IN
= 12 V, V
= 3.3 V...................................................................................................
IN
= 3.3 V...................................................................................................
List of Tables
Copyright © 2023 Texas Instruments Incorporated
= 24 V, SPSP
ON.....................................................................11
IN
ON.............................................................................11
Family..................................................................................1
www.ti.com
25°C)........................................9
SLVUCN1 - JANUARY 2023
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