Table Of Contents - Texas Instruments TLVM13610EVM User Manual

Table of Contents

1 High-Density EVM Description..............................................................................................................................................
1.1 Typical Applications............................................................................................................................................................3
2 Test Setup and Procedure......................................................................................................................................................4
2.1 EVM Connections..............................................................................................................................................................
2.2 EVM Setup.........................................................................................................................................................................
2.3 Test Equipment..................................................................................................................................................................
2.4 Recommended Test Setup.................................................................................................................................................6
2.5 Test Procedure...................................................................................................................................................................
3 Test Data and Performance Curves......................................................................................................................................
3.1 Efficiency and Load Regulation Performance....................................................................................................................
3.2 Waveforms.........................................................................................................................................................................
3.3 Bode Plot............................................................................................................................................................................9
3.4 EMI Performance..............................................................................................................................................................11
4 EVM Documentation.............................................................................................................................................................12
4.1 Schematic........................................................................................................................................................................
4.2 Bill of Materials.................................................................................................................................................................13
4.3 PCB Layout......................................................................................................................................................................
4.4 Multi-Layer Stackup.........................................................................................................................................................
5 Device and Documentation
5.1 Device Support.................................................................................................................................................................17
5.2 Documentation Support...................................................................................................................................................
Figure 2-1. EVM Test Setup.........................................................................................................................................................4
Figure 3-1. Efficiency, V
OUT
Figure 3-2. Load Regulation, V
Figure 3-3. Efficiency, V
OUT
Figure 3-4. Load Regulation, V
Figure 3-5. Start-Up to V = 24 V...............................................................................................................................................
IN
Figure 3-6. Shutdown .................................................................................................................................................................
Figure 3-7. Enable ON and OFF
Figure 3-8. Load Transient, 4 A to 8 A at 1
Figure 3-9. Infrared Thermal Image V
Figure 3-10. Infrared Thermal Image V
Figure 3-11. Infrared Thermal Image V
Figure 3-12. Infrared Thermal Image V
Figure 3-13. Bode Plot With Four 47-µF, 16-V Output Capacitors (110 µF Effective at 5 VDC,
Figure 3-14. Output Capacitor Voltage Derating Curve.............................................................................................................
Figure 3-15. CISPR 11/32 Class B Conducted Emissions: V
Figure 3-16. CISPR 11 Class B Radiated Emissions: V
Figure 4-1. EVM Schematic.......................................................................................................................................................12
Figure 4-2. 3D Top View............................................................................................................................................................
Figure 4-3. 3D Bottom View.......................................................................................................................................................14
Figure 4-4. Top Layer Copper....................................................................................................................................................15
Figure 4-5. Layer 2 Copper........................................................................................................................................................15
Figure 4-6. Layer 3 Copper........................................................................................................................................................16
Figure 4-7. Bottom Layer Copper (Viewed From Top)...............................................................................................................
Figure 4-8. Layer Stackup.........................................................................................................................................................
Table 1-1. TLVM13610 Synchronous Buck DC/DC Power Module
Table 2-1. EVM Power Connections............................................................................................................................................
Table 2-2. EVM Signal Connections............................................................................................................................................
Table 4-1. Component BOM......................................................................................................................................................
Trademarks
HotRod ™ is a trademark of Texas Instruments.
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All trademarks are the property of their respective owners.
2 TLVM13610EVM Buck Regulator Evaluation Module
Table of Contents
Support...................................................................................................................................17
List of Figures
= 5 V, F = 1 MHz, AUTO Mode...................................................................................................
SW
= 5 V, F = 1 MHz, AUTO Mode........................................................................................
OUT SW
= 3.3 V, F = 1 MHz, AUTO Mode................................................................................................
SW
= 3.3 V, F = 1 MHz, AUTO Mode.....................................................................................
OUT SW
.................................................................................................................................................8
A/µs..........................................................................................................................8
= 12 V, V = 5 V........................................................................................................
IN OUT
= 24 V, V = 5 V......................................................................................................
IN OUT
= 12 V, V = 3.3 V...................................................................................................
IN OUT
= 24 V, V = 3.3 V...................................................................................................
IN OUT
IN
List of Tables
Copyright © 2023 Texas Instruments Incorporated
= 24 V, SPSP ON.....................................................................11
IN
= 24 V, SPSP ON.............................................................................11
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25°C)........................................9
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