User Guide
EVAL-ADGM1144
LAYOUT RECOMMENDATIONS
The EVAL-ADGM1144SDZ is a 4-layer board. The EVAL-
ADGM1144SDZ uses 8 mil Roger RO4003C dielectric. The outer
copper layers have 2.2 mil finish thickness with electroless nickel
immersion gold (ENIG) finish. The RF transmission lines were
designed using a micro strip model with a width of 17 mil and
ground spacing of 50 mil to have a characteristic impedance of 50
Ω (see
Figure 14
and
Figure
15). It is recommended to use plenty
of vias under the
ADGM1144
and along the RF traces to provide
good grounding and to avoid any resonance at high frequencies.
To achieve optimum RF performance, Rosenberger right angle jack
connectors (32K243-40ML5) are used.
Figure 14. EVAL-ADGM1144SDZ Board Stackup
Figure 15. EVAL-ADGM1144SDZ Additional Board Manufacturing Information
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