Lenovo ThinkSystem SR630 Maintenance Manual page 192

• To ensure the best performance, check the manufacturing date on the new heat sink and make sure it
does not exceed 2 years. Otherwise, wipe off the existing thermal grease and apply the new grease onto it
for optimal thermal performance.
Notes:
• The heat sink, processor, and processor carrier for the system might be different from those shown in the
illustrations.
• PHMs are keyed for the socket where they can be installed and for their orientation in the socket.
• See
https://static.lenovo.com/us/en/serverproven/index.shtml
server. All processors on the system board must have the same speed, number of cores, and frequency.
• Before you install a new PHM or replacement processor, update your system firmware to the latest level.
See "Update the firmware" in the ThinkSystem SR630 V2 Setup Guide.
The following illustration shows the components of the PHM.
Figure 104. PHM components
Heat sink
1
Heat sink triangular mark
2
Processor identification label
3
Nut and wire bail retainer
4
Torx T30 nut
5
Anti-tilt wire bail
6
Processor carrier
7
Clips to secure carrier to heat sink
8
ThinkSystem SR630 V2 Maintenance Manual
182
for a list of processors supported for your
Clips to secure processor in carrier
9
Carrier triangular mark
10
Processor ejector handle
11
Processor heat spreader
12
Thermal grease
13
Processor contacts
14
Processor triangular mark
15