AD7195
ABSOLUTE MAXIMUM RATINGS
T
= 25°C, unless otherwise noted.
A
Table 3.
Parameter
AV
to AGND
DD
DV
to AGND
DD
AGND to DGND
Analog Input Voltage to AGND
Reference Input Voltage to AGND
Digital Input Voltage to DGND
Digital Output Voltage to DGND
AIN/Digital Input Current
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Lead Temperature, Soldering
Reflow
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
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Rating
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to +0.3 V
−0.3 V to AV
+ 0.3 V
DD
−0.3 V to AV
+ 0.3 V
DD
−0.3 V to DV
+ 0.3 V
DD
−0.3 V to DV
+ 0.3 V
DD
10 mA
−40°C to +105°C
−65°C to +150°C
150°C
260°C
Rev. 0 | Page 8 of 44
THERMAL RESISTANCE
θ
is specified for the worst-case conditions, that is, a device
JA
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
32-Lead LFCSP_WQ
ESD CAUTION
θ
θ
Unit
JA
JC
32.5
32.71
°C/W
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