Thermal Pcb Design - Infineon EVAL-IMI111T User Manual

EVAL-IMI111T user guide
iMOTION™ MADK starter kit for IMI111T IPMs
Thermal characterization
5.2

Thermal PCB design

IMI111T relies on the leads to transfer thermal dissipation from the power devices to the PCB. There are several
critical pins that need attention to achieve improved thermal performance of the module. Figure 20 shows the
pins critical for thermal dissipation. These include V+ (17, 18), UN (12), VN (13), and W (14, 15). Copper areas
connected to the critical pins have to be optimized as much as possible on both layers to provide more thermal
transfer capability. Figure 21 shows the PCB design on both layers with respect to the critical pins.
Critical pins for thermal PCB design
Figure 20
Eval board PCB designs for both the top and bottom layers regarding critical pins
Figure 21
User guide 21 of 37 V2.1
2022-12-9