Infineon ICE2HS01G Application Note

Design guide for llc converter

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A p p l i c a t i o n N o t e , V 1 . 0 , J u l y 2 0 1 1
D e s i g n G u i d e f o r L L C C o n v e r t e r
w i t h I C E 2 H S 0 1 G
P o w e r M a n a g e m e n t & S u p p l y
N e v e r
s t o p
t h i n k i n g .

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Summary of Contents for Infineon ICE2HS01G

  • Page 1 A p p l i c a t i o n N o t e , V 1 . 0 , J u l y 2 0 1 1 D e s i g n G u i d e f o r L L C C o n v e r t e r w i t h I C E 2 H S 0 1 G P o w e r M a n a g e m e n t &...
  • Page 2 Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system.
  • Page 3 Design Guide for LLC Converter with ICE2HS01 V1.0 Revision History: 2011-07 Previous Version: Design Guide for LLC Converter with ICE2HS01G License to Infineon Technologies Asia Pacific Pte Ltd A N - P S 0 0 5 7 Liu Jianwei Li Dong...
  • Page 4: Table Of Contents

    Page Table of Content Abstract ..................... 5     Design Procedure ................5         Target Specifications ........................5     Design of Power Stage ......................... 6 2.2.1 System specifications ........................6     2.2.2 Selection of resonant factor m ......................6  ...
  • Page 5: Abstract

    No individual SR controller IC is needed at the secondary side. A typical application circuit of ICE2HS01G is shown in Figure 1. For best performance, it is suggested to use half-bridge driver IC in the primary side with ICE2HS01G.
  • Page 6: Design Of Power Stage

    The design example is based on the typical application circuit in Figure 1, where individual resonant choke is implemented. The target specifications are summarized in Table 1. 400VDC Input voltage 12VDC, 25A Output voltage and current ~ 300W Output power η...
  • Page 7: Voltage Gain

    2.2.3 Voltage gain It is for efficiency optimization to operate the LLC converter around the resonant frequency at nominal input voltage, where the voltage gain , on condition that the secondary-side leakage inductance is neglected due to the implementation of individual resonant choke. The worst case we need to consider for resonant network and transformer design is the full load operation at minimum input voltage .
  • Page 8 1.413 0.22 1.325 0.267 1.238 0.35 1.15 0.65 1.063 Line 0.975 0.888 0.35 0.65 0.95 1.25 Figure 2 Voltage gain Vs normalized frequency Among the curves, we find that the one with can achieve the required peak gain , which is 8% higher than for design margin, i.e.
  • Page 9: Transformer Design

    [11] η The peak current is . The OCP level is set with about 20% margin: The actual leakage inductance ( ) measured at primary side with one of the secondary side winding leak shorted is around 13uH. Therefore, the inductance for the independent resonant choke is: −...
  • Page 10: Sr Mosfet

    2.2.8 SR MOSFET The voltage stress on the drain-source of the MOSFET is: The RMS value of the current flowing through each MOSFET is: π Design of Control Parameters and Protections 2.3.1 Frequency setting: The IC internal circuit provides a regulated 2V voltage at FREQ pin. The effective resistance presented between the FREQ pin and GND, determines the current flowing out of the FREQ pin, which in turn defines the switching frequency.
  • Page 11: Frequency Setting For Ocp

    As discussed in section 2.2.7, the lowest switching will be seen in full load operation at . In this section, how the is actually set by the IC is explained. Based on the definition of oscillator as in the datasheet and the external circuit around pin FREQ in Figure 1, the minimum switching frequency will be achieved when pin SS is 2V (usually after softstart), opto-coupler transistor is open and only is connected to pin FREQ.
  • Page 12: Dead Time

    Solve the equation and find Then is 5kΩ according to Figure 3. According to the definition of over-current protection, FMIN Then can be found as 5.6kΩ. 2.3.4 Dead time The dead time selection should ensure ZVS of two primary-side MOSFET IPA60R199CP at maximum switching frequency, where the magnetizing current to charge and discharge is the minimum.
  • Page 13: Softstart Time, Olp Blanking Time And Auto-Restart Time

    2.3.5 Softstart time, OLP blanking time and auto-restart time According to the definition of the softstart of the IC in the datasheet, soft start is implemented by sweeping the operating frequency from an initial high value until the control loop takes over. The softstart time depends on a few components, such as the , the value of and the value of...
  • Page 14 Figure 5 Current sense circuit Assuming capacitive current divider is adopted as current sense circuit. So is chosen to be far less than e. g, around , say 470pF. is normally of a few hundred Ω for filtering purpose, say 200Ω.
  • Page 15: Vins Pin Setting

    2.3.8 VINS pin setting The minimum operation input voltage needs to be specified for LLC resonant converter with the Vins pin. The typical circuit of mains input voltage sense and process is shown Figure 6. Figure 6 Mains input voltage sense The mains input voltage is divided by .
  • Page 16: Design Of Synchronous Rectification (Sr) Control

    Synchronous Rectification (SR) in a half-bridge LLC resonant converter is one of the key factor to achieve high efficiency. SR control is a major benefit we offer with our new LLC controller IC ICE2HS01G. Before going into details of SR control of the IC, it’s necessary to understand the ideal SR switching mechanism for two typical working conditions, i.e.
  • Page 17 In this condition, the SR MOSFET on-time is almost constant and nearly half of the resonant period. The control of SR in ICE2HS01G consists of four main parts: on-time control, turn-on delay, advanced turn-off delay and protections, with the block diagram shown in Figure 8.
  • Page 18: On-Time Control - Srd Pin And Cl Pin

    Figure 8 Synchronous rectification control block diagram 2.4.1 On-time control - SRD pin and CL pin With ICE2HS01’s control scheme, SR MOSFET ‘s turning-off depends on two conditions - turning-off of the primary gate and the “off” instruction from SR on-time block, where the maximum on-time preset.
  • Page 19 The primary winding current can reflects this change. The current sense circuit can be designed to get such information and input to CS pin. In ICE2HS01G, a function called current level (CL) pin is implemented. During heavy load and low input voltage, the CL pin voltage is clamped at same voltage of SRD pin, 2V.
  • Page 20: Turn-On Delay T

    For better performance, the other SR MOSFET should be turn on after the recovery phase. The turn-on delay function is built in ICE2HS01G for such purpose. When the sensed input voltage at VINS pin is higher than the reference voltage set by Vres pin according to the resonant voltage, SR turn-on delay is added, i.e, the SR MOSFETs are turn on 250ns after the corresponding...
  • Page 21: Advanced Turn Off Delay

    2.4.3 Advanced Turn off delay - Delay pin delay Advanced turn-off delay time of the SR MOSFET , normally is determined by the propagate delay delay and transition time in the actual converter system. The value of can be set by the Delay delay Ω...
  • Page 22: Sr Protections

    SR Protections As the SR control in ICE2HS01G is realized with indirect method, there are some cases that the SR can not work properly. In this cases, the SR gate drive will be disabled. Once the condition is over, IC will restart the SR with SRSoftstart.
  • Page 23 C103 2n2/Y1 SGND P_VBUS RT100 5R C100 S_HD 270uF/450V Q100 R102 R100 Q101 TR100 IPA60R199CP C102 P_PGND P_HG S_HG 015N04 PQ3230 33nF/630V R101 R103 S_HS P_VCC P_HS L100 40uH//RM10 P_VCC C104 C105 P_VCr 100n/25V 10u/25V Q102 S_LD IPA60R199CP C107 C108 C109 C110 C111...
  • Page 24: Tips On Pcb Layout

    Tips on PCB layout In order to avoid crosstalk on the board between power and signal path, and to keep the IC GND pin as “clean” from noise as possible, the PCB layout must be taken care of properly. Below are some suggestions as reference and customer can modify based on their own experience.
  • Page 25: Star Connection For Ic

    Star connection for IC 1. Connect the following ground directly back to Vcc 100nF cap ground (please refer to the red curves in the circuit diagram below) • FREQ pin resistor ground • Delay pin resistor ground • SRD resistor ground 2.
  • Page 26 References Infineon Technologies: ICE2HS01 - High Performance Resonant Mode Controller for Half-bridge LLC Resonant Converter; datasheet Ver 2.0; Infineon Technologies; Munich; Germany; May. 2010. Application Note 2011-07-06...

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