Lenovo ThinkEdge SE450 Maintenance Manual page 139

Attention:
• Go over "Installation Guidelines" on page 41
• Turn off the server and peripheral devices and disconnect the power cords and all external cables (see
"Power off the server" on page
• If the server is installed in a rack, slide the server out on its rack slide rails to gain access to the top cover,
or remove the server from the rack.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.
• Do not touch the processor contacts. Contaminants on the processor contacts, such as oil from your skin,
can cause connection failures.
• Do not allow the thermal grease on the processor or heat sink to come in contact with anything. Contact
with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage
components, such as the electrical connectors in the processor socket.
Note: The heat sink, processor, and processor carrier for your system might be different than those shown
in the illustrations.
Watch the procedure.
•
https://www.youtube.com/playlist?list=PLYV5R7hVcs-DV_Ja2E7l6T-lwN_IrnJRk
Procedure
Step 1. Separate the processor from the heat sink and carrier.
Figure 124. Separating a processor from the heat sink and carrier
Note: Do not touch the contacts on the processor.
Lift the handle to release the processor from the carrier.
Hold the processor by its edges; then, lift the processor from the heat sink and carrier.
Without putting the processor down, wipe the thermal grease from the top of the processor
with an alcohol cleaning pad; then, place the processor on a static protective surface with the
processor-contact side up.
Step 2. Separate the processor carrier from the heat sink.
to ensure that you work with safety.
13).
A video of this procedure is available from the following link:
.
Chapter 3 Hardware replacement procedures
131