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1 Introduction
The CC2564MODNEM evaluation board contains the CC2564MODN device. TI intends the board for evaluation
and design purposes. For a complete evaluation solution, the CC2564MODNEM board plugs directly into the
following TI hardware development kits:
•
MSP-EXP430F5529
•
MSP-EXP430F5438
•
DK-TM4C123G
•
DK-TM4C129X
•
Other MCU
A certified and royalty-free TI Bluetooth stack (TIBLUETOOTHSTACK-SDK) is available for the MSP430
TM4C12x MCUs. The CC2564MODNEM hardware design files (schematics, layout, and bill of materials [BOM])
are provided as a reference to aid in the implementation of the CC2564MODN device.
2 Features
•
Features a CC2564MODN device (MOE package)
•
Supports Bluetooth Specification v4.1
•
Supports dual-mode – Bluetooth + Bluetooth low energy
•
Offers class 1.5-transmit power (+10 dBm)
•
Offers high sensitivity (–93 dBm typical)
•
Offers a 32.768-kHz oscillator
•
Offers a UART interface – control and data
•
Offers a PCM/I2S interface – voice and audio
•
Offers 4-layer PCB design
•
Offers 1.8 LDO (LP2985-18)
•
Offers three voltage level translators (SN74AVC4T774)
•
Offers a chip antenna (LTA-5320-2G4S3-A1)
•
Offers a RF connector (U.FL-R-SMT-1)
•
Offers EM connectors that plug directly into the following TI hardware development kits:
– MSP-EXP430F5529
– MSP-EXP430F5438
– DK-TM4C123G
– DK-TM4C129X
– Other MCU
•
Offers COM connectors that plug directly into the TI hardware development kits
•
Features Certified and royalty-free TI dual-mode Bluetooth stack (TIBLUETOOTHSTACK-SDK):
™
– MSP430
(CC256XMSPBTBLESW)
– TM4C (CC256XM4BTBLESW)
– Other MCU (CC256XSTBTBLESW)
SWRU390A – AUGUST 2014 – REVISED AUGUST 2021
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Dual-Mode Bluetooth
CC2564 Module Evaluation Board
Introduction
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