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7 Overview
The CC2564MODNEM board is the development environment for the CC2564MODN module and plugs directly
into TI's MSP430 and TM4C experimenter boards with EM connectors that simplify prototype wiring and field
trials.
This module is based upon TI's CC2564B device and uses a host controller interface (HCI); this module is a
cost-effective and flexible way to implement a Bluetooth network. The HCI reduces the cost of the BOM by giving
designers the flexibility to choose a controller and eliminating redundant processing capacity while the Bluetooth
stack resides and executes on the host processor of the application.
The CC2564MODNEM board has two connectors: EM and COM. The I/Os for the EM are at 3.3 V, which is the
default assembly configuration. The I/Os for the COM are at 1.8 V and require hardware modification.
TI intends the CC2564MODNEM board for evaluation purposes and to work with TI's Hardware Development
Kit. Refer to
Section 9
for further details.
To implement this reference design, schematic and layout files are available on the
page.
SWRU390A – AUGUST 2014 – REVISED AUGUST 2021
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Figure 7-1. CC2564MODNEM Board Front Overview
Copyright © 2021 Texas Instruments Incorporated
CC2564MODN product
®
Dual-Mode Bluetooth
CC2564 Module Evaluation Board
Overview
7
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