Chapter 4: Hardware Setup; Preparing The Hardware Installation; Installing The System Memory - Lanner LEC-2270 User Manual

Embedded & industrial computing
Table of Contents

Advertisement

Chapter 4
Chapter 4:
Hardware Setup

Preparing the Hardware Installation

To access some components and perform certain service
procedures, you must perform the following procedures
first.
WARNING: To reduce the risk of personal injury,
electric shock, or damage to the equipment,
remove the power cord to remove power from
the server. The power switch button does not
completely shut off system power. Portions of the
power supply and some internal circuitry remain
active until power is removed.
1.
Unpower the LEC-2270 and remove the power cord.
2.
Unscrew the 4 threaded screws from the top cover.
3.
Open the cover.
Note:
If the CPU thermal pad mounting breaks apart,
use your hands to reattach the falling parts and
stick them together.
Embedded and Industrial Computing

Installing the System Memory

The motherboard supports DDR3 memory to meet the
higher bandwidth requirements of the latest operating
system and Internet applications. It comes with two
Double Data Rate Three (DDR3) Small Outline Dual Inline
Memory Module (SO-DIMM) socket.
1.
Align the memory module's cutout with the SO-DIMM
socket's notch.
2.
Install the SO-DIMM.
2
1
Note:
The system can support memory of DDR3 SO-
DIMM up to 16 GB in maximum with 2 SO-DIMM
sockets.
Hardware Setup
21

Advertisement

Table of Contents
loading

This manual is also suitable for:

Lec-2270eLec-2270p2

Table of Contents