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NOTE
1.
To avoid blistering, layer separation and other soldering issues, extended exposure of the module to
the air is forbidden.
2.
Take out the module from the package and put it on high-temperature-resistant fixtures before
baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in
the drying oven. Pay attention to ESD protection, such as wearing anti-static gloves, when touching
the modules.
3.
If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
8.2
8.2 Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. Apply proper force on the squeegee to produce a clean
stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the
module is recommended to be 0.18–0.20 mm. For more details, see document [4].
The peak reflow temperature should be 235 – 246 º C, with 246 º C as the absolute maximum reflow
temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended
that the module should be mounted only after reflow soldering for the other side of PCB has been
completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related
parameters are shown below.
Temp. (°C)
246
235
217
200
Soak Zone
150
100
Figure 40: Recommended Reflow Soldering Thermal Profile
EG915U_Series_Hardware_Design
A
Max slope: 1~3 °C/s
LTE Standard Module Series
Reflow Zone
Max slope:
Cooling down slope:
C
2~3 °C/s
-1.5 ~ -3 °C/s
B
D
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