Recommended Footprint - Quectel EG915U Series Hardware Design

7.3 Recommended Footprint

.
NOTE
1. For easy maintenance of the module, keep about 3 mm between the module and other components
on the motherboard.
2. To keep the reliability of the mounting and soldering, keep the motherboard thickness as at least
1.2 mm
EG915U_Series_Hardware_Design
Figure 38: Recommended Footprint (TOP View)
LTE Standard Module Series
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