Blackrock processor
Parameter
Height
Width
Depth
Weight (†)
Heat Dissipation
Voltage
Current
Power Factor
Fusing
Noise
Connectors
† Blackrock processor units must be supported on rack shelves. Do not rely on the rack ears alone.
Rio
Parameter
Height
Width
Depth
Weight (†)
Heat Dissipation
Voltage
Current
Power Factor
Fusing
Noise
Connectors
† RIO units must be supported on rack shelves. Do not rely on the rack ears alone.
C100 HDS Installation Manual
Condition
Case only without rack ears
Range
Maximum over voltage range
Thermal current trip. No fuses
Front
Rear
Power in 1 and 2
Networks
Sync In
Fibre I/O
Condition
Case only without rack ears
5 Mic cards
1 Mic, 2 analogue, 1 digital card
Range
Maximum over voltage range
Thermal current trip. No fuses
Front
Rear
Power in 1 and 2
Network
Sync out
Madi 1–4
GPI Input
GPI Output
Value
Unit
2
U
89
mm
19
in
449
mm
429
mm
14
kg
200
W
100 – 240
V
2.1 – 0.9
A
0.95
50
NR
55
NR
IEC male
RJ45
BNC 75
Duplex LC
Value
Unit
7
U
665
mm
19
in
449
mm
344
mm
17 – 21
kg
500
W
350
W
100 – 240
V
5.6 – 2.3
A
0.95
45 – 55
NR
45 – 60
NR
IEC male
RJ45 100 baseT
BNC 75
Duplex LC fibre multimode
25-way D-type male
25-way D-type female
Section 4 – Appendices
Specifications
Notes
Excludes connectors/cables
Shared between two PSUs
±10%, 50/60Hz AC only
Maximum
Approximately
Both PSUs powered
Both PSUs powered
Multimode or singlemode to order
Notes
Excludes connectors/cables
Depending on I/O fitted
Maximum
Typical
±10%, AC only
Approximately
Variable speed fans
(unused)
(Wordclock)
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Page 4-3
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