NEC MultiSync 20WGX2 Series Service Manual page 2

1. Safety guideline in servicing
1)
Never touch the portions with the marking (
Serious injury or even death may result.
2)
Do not expose the set to rain or water.
A risk of fire or electric shock can result.
3)
Use an adequate power cord.
A risk of fire or electric shock can result.
4)
Do not attempt to service or modify the set without prior permission of the manufacturer.
A risk of fire or electric shock can result.
5)
Leave the maintenance service to a service engineer having qualification, knowledge and
experience.
A risk of electric shock, injury or fire can result.
6)
Always employ genuine parts indicated in the service manual for replacement.
A risk of fire or electric shock can result.
7)
In reassembling use the specified binding bands, clampers, tubes and barriers--all of which
are necessary for insulation/protection--in their original positions.
A risk of fire or electric shock can result.
2. Other cautions necessary
1) When removing the cables from their connectors, take care not to damage the wire portions so as to
prevent the occurrence of poor contact.
2) When attaching/detaching screws, use a screwdriver that is well-fit to the screw size.
3. Caution for LEAD-FREE soldering work
For this equipment, parts compatible with lead-free materials are used.
Please observe the following precautions, when performing any soldering work.
1) Use lead-free solder for substrates mounted with lead-free parts.
If you use eutectic solder by mistake, solder will not fuse well because of the difference in fusion point.
2) Fusion Point
Lead-free solder:
Eutectic solder : 183°C
3) Solder composition of Lead-free solder: Sn-3.0Ag-0.5Cu
[Maker]
Nihon Genma
Senju metal
(#:This mark shows the diameter of the solder wire.)
4) Use without fail a temperature adjustable soldering iron for working with lead-free solder. Moreover,
the power consumption of the soldering iron must use from 25W to 75W.
[Solder Iron tip temperature and contact time]
*SMD Chip
*SMD QFP
Heat sink
Ax,RD
*SMD: Surface Mounting Device
220°C
[Type]
DHB-RMA NP303-###
ESC F3 M705E-###
Category of Parts
The Parts of Chip type
The Parts (IC) of Quad Flat Pack Package type
Heat sink
The Parts of Axial or Radial type
(The Electric Parts other than the above-mentioned.
Ex.: IC, Transistor, Resistor, Capacitor)
).
Lead-free solder
300-320°C
(1-3sec)
320-350°C
(1-3sec)
360-380°C
(1-3sec)
340-370°C
(1-3sec)
Eutectic solder
260-280°C
(1-3sec)
280-300°C
(1-3sec)
320-420°C
(1-3sec)
350-390°C
(1-3sec)