Open-X 8M Som; Som Mechanical Properties - Intrinsyc Open-X 8M User Manual

Development kit based on the nxp i.mx8 processor
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Open-X™ 8M Development Kit based on the NXP i.MX8™ Processor User Guide Version 1.0

3.7 Open-X 8M SOM

The SOM provides the basic common set of features with minimal integration efforts for end users.
It contains the following:
• i.MX 8M (MiMX8MQ6DVAJZAB) main application processor
• LPDDR4 1600MHz 3GB RAM
• 16 GB eMMC Flash storage
• MC34PF4210A1ES – PMIC for Peripheral LDOs, Boost Regulators
• QCA6174A-1 Wi-Fi + BT pre-certified module over PCIe, UART, PCM

SOM Mechanical Properties

Area
Interface
Thermal
Figure 3-3 Open-X 8M SOM
2
19.25 cm
(55 mm x 35 mm)
3x 100-pins SOM to carrier board connector (B2B Connector)
An optional top side heat sink can be installed
Copyright Intrinsyc Technologies Corporation
55mm
11
35mm

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