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2.2 Technical specifications
Processors
®
NXP i.MX6 Family, based on ARM
-
i.MX6S Solo - Single core up to 1GHz
-
i.MX6D Dual - Dual core up to 1.2GHz per core
-
i.MX6DL Dual Lite - Dual core up to 1GHz per core
-
i.MX6Q Quad - Quad core up to 1.2GHz per core
Memory
Up to 2GB DDR3l soldered onboard (up to 1GB with i.MX6S)
Graphics
Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL
Dedicated Vector Graphics accelerator supports OpenVG
i.MX6Q)
Supports up to 3 independent displays with i.MX6D and i.MX6Q
Supports 2 independent displays with i.MX6DL and i.MX6S
Video Interface
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18/24 bit interface
HDMI Interface
Video Input Port / Camera connector (only with PCB rev. C or higher)
Video Resolution
LVDS, up to 1920x1200
HDMI, up to 1080p
Mass Storage
Onboard eMMC Disk, up to 8 GB *
mSATA Half-length slot (shared with miniPCI-express)
* Please consider that for HDD and Flash Disk manufacturers, 1GB = 10^9 Byte.
Some OS (like, for example, Windows) intends 1GB = 1024^3 byte, so global
capacity shown for Disk Properties will be less than expected. Please also consider
that a portion of disk capacity will be used by internal Flash Controller for Disk
management, so final capacity will be lower
CORTEX-A9 processors
®
ES2.0 3D
™
(only i.MX6D and
USB
3 x standard USB 2.0 Type A
1 x USB OTG on micro-AB connector
Internal USB for optional WiFi module
Networking
Gigabit Ethernet connector
Audio
AC'97 Audio Codec
Mic In, Line out internal pin header connector
PCI Express
Half-mini PCI-e slot, shared with mSATA (only PCI-e 1.1 and Gen2 are supported)
Serial ports
1x RS-232 serial port
TTL debug UART (Tx, RX only)
CAN interface internal connector
Other Interfaces
I2C touch Connector
Internal connector for power and reset buttons
Power supply
+12VDC ± 10%
Embedded additional RTC circuitry for lowest power consumption
Optional RTC Battery with lead cable and connector
Operating temperature:
0°C ÷ +70°C** (commercial version)
-40°C ÷ +85°C (industrial version)
Dimensions: 80 x 67 mm (3.15" x 2.64").
Supported Operating Systems:
Linux
** is to be considered at any point of the heatspreader/heatsink. Actual
temperature will widely depend on application, enclosure and/or
environment. Upon customer to consider specific cooling solutions for the
final system.
Please also check paragraph 4.1
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