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4.1 Thermal Design
Highly integrated systems, like the SBC-984 board, offer the user excellent performance in a very reduced space, therefore allowing the system's minimization. On
the other hand, the miniaturizing of IC's and the increase of clock frequencies of the processors lead to the generation of a big amount of heat that must be
dissipated to prevent critical operating conditions, system hang-off or failures.
It is extremely important to note that, for this reason, a critical design parameter always to be kept in very high consideration is the thermal design and analysis of
the final assembled system. It is necessary to carefully consider the heat generated by the module in the final assembled system and the application.
The customer must always ensure that the heatspreader/heatsink surface temperature remain within the declared operating temperature range at any
point of the cooling element.
SECO can provide the customer with SBC-984 specific heatspreader and/or passive heatsink, which will act ONLY as a thermal coupling device. It is not intended
to be a stand-alone cooling system, but a means of transferring heat to an external, passive or active cooling element, like heatsinks, fans, heat pipes, etc. The
SECO heatspreader is thermally coupled to the most critical heat - generating board components and surfaces using a thermal gap pad, which optimizes the heat
exchange between the module and the heatspreader.
During the development phase, in a laboratory, in free - air conditions or just for software development and system tuning, then a simple heatsink might be
sufficient to cool the board and keep it within its declared operating temperature range (especially for the i.MX6 Solo and Dual Lite versions). However, please keep
in mind that all these considerations depend on the workload of the processor. Heavy computational tasks will generate much more heat on all versions of the
processor.
Therefore, it is always necessary that the customer study and develop a specifically tailored cooling solution for the final system by evaluating processor's workload,
application environment, system enclosure, air flow and so on. Please remember that the use of SECO heat-dissipation components must be accurately evaluated
within the final system and that they should be part of a more comprehensive ad-hoc cooling solution.
Ordering Code
Description
S984-DISS-1-C-PK
SBC-984 Heat Spreader (passive) for COMMERCIAL VERSION and Solo & DualLite INDUSTRIAL, packaged
S984-DISS-1-I-PK
SBC-984 Heat Spreader (passive) for Dual and Quad (AUTOMOTIVE & INDUSTRIAL), packaged
S984-DISS-2-C-PK
SBC-984 Heatsink (Passive) for COMMERCIAL VERSION and Solo & DualLite INDUSTRIAL, packaged
S984-DISS-2-I-PK
SBC-984 Heatsink (passive) for Dual and Quad (AUTOMOTIVE & INDUSTRIAL), packaged
SBC-984
SBC-984 User Manual - Rev. First Edition: 1.0 - Last Edition: 4.0 - Author: S.B. - Reviewed by N.P. Copyright © 2016 SECO S.r.l.
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