Chapter4 Setup And Procedures Before Operation; Handling Precautions - Mitsubishi MELSEC-Q Series User Manual

4
SETUP AND PROCEDURES BEFORE OPERATION
CHAPTER4
4.1

Handling Precautions

(1) Do not drop or give a strong impact to the case.
(2) Do not remove the printed-circuit board of the module from the case.
(3) Be careful to prevent foreign matters such as cutting chips or wire chips
(4) A protective film is attached to the module top to prevent foreign matter
(5) Tighten the screws such as module fixing screws within the following
(6) When mounting the module to the base unit, insert the module fixing
(7) Always make sure to touch the grounded metal to discharge the
4
- 1 4.1 Handling Precautions
SETUP AND PROCEDURES BEFORE
OPERATION
Doing so may cause a failure.
from entering the module.
Failure to do so may cause a fire, failure or malfunction.
such as wire chips from entering the module during wiring.
Do not remove the film during wiring.
Be sure to remove it for heat dissipation before system operation.
ranges.
Screw location
Module fixing screw (M3 screw)
Connector screw (M2.6 screw)
* 1 The module can be easily fixed onto the base unit using the hook at the top of the module.
However, it is recommended to secure the module with the module fixing screw if the module is
subject to significant vibration.
projection into the fixing hole in the base unit, and mount the module
with using the hole as a supporting point.
Incorrect module mounting may cause a malfunction, failure, or drop of
the module.
electricity charged in the body, etc., before touching the module.
Failure to do so may cause a failure or malfunctions of the module.
Table 4.1 Tightening torque
*1
Tightening torque range
0.36 to 0.48N•m
0.20 to 0.29N•m