Package Contents
1. Open-Q™ 212A SOM with APQ8009 SoC
2. Open-Q™ 212A Carrier Board
3. AC Power Adapter
4. Camera Adaptor Board (Optional Accessory)
1. WLAN Antenna 1 (PCB Trace)
22. Audio Expansion Header
2. Configuration DIP switches
23. Micro-USB port
3. Automation Header
24. MIPI-DSI LCD/Display Connector*
4. Power header
25. Headset Connector
5. BT Antenna (PCB trace)
26. Power Button
6. MIPI-CSI Camera 0 Connector*
27. Volume + button
7. Digital Audio Codec header
28. Volume - button
8. Battery Charging header
29. HDMI Connector
9. MIPI-CSI Camera 1 Connector*
30. Wi-Fi U.FL Antenna 1 Connector
(not supported)
31. Wi-Fi U.FL Antenna 0 Connector
10. USB Type-C Connector (not sup-
32. BT U.FL Antenna Connector
ported)
33. WLAN/BT Module
11. 12V DC Power jack
34. GPS U.FL Antenna Connector
12. GPS External Antenna Connector
35. Snapdragon APQ8009 CPU
13. Accessory header (sensors, etc.)
36. Open-Q 212A System on Module
14. GPS PCB Antenna*
15. Power Source Switch (Batt/DC)
16. Battery connector
* ON BOTTOM SIDE
17. USB Debug UART Micro B
18. SOM Power Probe header
19. Speaker Connector
20. WLAN Antenna 2 (PCB Trace)
21. USB Type-A Dual Stack Host
Specifications are subject to change - Open-Q 212A DK QSG Rev. 1.0
Your use of this document is subject to and governed by those terms and conditions, https://www.intrinsyc.com/legal-terms/qualcomm-terms.html, in the Intrinsyc Purchase and Software License Agreement for the Open-Q™ 212A Development Kit based on the Qualcomm® Snapdragon™
212 Processor (APQ8009), which you or the legal entity you represent, as the case may be, accepted and agreed to when purchasing an Open-Q™ 212A Development Kit from Intrinsyc Technologies Corporation ("Agreement"). You may use this document, which shall be considered part of the
defined term "Documentation" for purposes of the Agreement, solely in support of your permitted use of the Open-Q™ 212A Development Kit under the Agreement. Distribution of this document is strictly prohibited without the express written permission of Intrinsyc Technologies Corpora-
tion and its respective licensors, which they can withhold, condition or delay in its sole discretion. Intrinsyc is a trademark of Intrinsyc Technologies Corporation, registered in Canada and other countries. Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated, registered in the
United States and other countries. Other product and brand names used herein may be trademarks or registered trademarks of their respective owners.
™
Open-Q
212A Development Kit
Quick Start Guide
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(SOM)
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