Pace TF 1500 Operation And Maintenance Manual page 7

Bga rework station
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iii. High power bottom heaters allow for successful and repeatable reflow at
iv. Profiles are programmed through the PC software.
v. Creating the perfect profile is easy with real time adjustment of profile
vi. Store and recall an infinite number of profiles.
vii. Two pre-defined profiles for use as baselines when developing custom
viii. Self contained, no external air supply or vacuum connections required.
ix. Semi-automated, motorized reflow head.
x. Four thermo-couple sensor inputs ensure successful profile development
xi. External fan to cool PCB and component to below solder melt
e. ALIGNMENT AND PLACEMENT FUNCTION
i. The component is held by a precision vacuum placement pick, which is
ii. High resolution Dual Color Vision Overlay System (VOS) with color
iii. Color Camera with 72x zoom capability, featuring auto-focus zoom.
iv. Lighting system uses "Ultra Bright" Red and Blue LEDs for maximum
v. Independent lighting controls for component and PCB to maximize
vi. Retractable optics housing protects VOS from dirt and contamination.
vii. Accurately places any array package up to 35mm (1.3") square and as
viii. Precise micrometer adjustment for X, and Y axis with Theta adjustment
ix. High-flow vacuum pick holds component securely.
x. Images are viewed through the PC in standard or full screen viewing
f.
PRE-HEAT FUNCTION AND BOARD HOLDER
i. Fully adjustable, precision, spring loaded board holder with top or bottom
ii. Rugged, stable board platform to hold and support the PCB.
iii. Unique board holding fixtures that are able to hold very small and odd
iv. Board supports are standard with the system.
v. Integrated, powerful, IR pre-heater with closed loop temperature control
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safe, low temperatures.
parameters through the PC.
profiles are included.
Can also be used with N
and monitoring.
temperatures after reflow.
located within the heater assembly.
camera and dichroic prism. VOS does not require routine calibration,
eliminating costly downtime and operator frustration.
contrast of lands and solder balls on component.
overlay contrast.
small as 1 mm (.04") square.
ensures placement accuracy.
options.
PCB registration. Precise micrometer adjustment for X and Y adjustment
ensures placement accuracy for repeatability.
shaped PCBs.
ensures process integrity by delivering heat evenly, time after time.
System Operations Manual
from external source.
2
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