Environmental Monitoring And System Management; Lm79 Hardware Monitor; Cpu Temperature Monitor - Motorola PATX3070 Series Installation And Use Manual

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Environmental Monitoring and System Management

The National LM79 hardware monitor device on the PATX3070
motherboard operates in tandem with the Intel 82559ER Ethernet
controller, the MAX1617 CPU temperature sensor, and the PIIX4E PCI-
to-ISA/IDE bridge and interrupt controller to provide a number of useful
system management features. These features are summarized below. For
details on their implementation, refer to the device data sheets and to the
PATX3070 BIOS and Programmer's Reference Guide, listed in
A, Related

LM79 Hardware Monitor

The LM79 device monitors system voltages, temperatures, and fan speeds.
Its readings can be sampled by system management software at any time.
It has programmable limit registers which can be configured to generate
SMIs (system management interrupts) as appropriate for your application.
SMI signals from the LM79 are routed to the PIIX4E's EXTSMI input.
The PATX3070 also includes circuitry for the detection of chassis
intrusion events. When implemented with appropriate sensory devices in
an enclosure, the intrusion detection circuitry is active continually (even
while the system is shut down, as long as backup battery or standby power
is present). Interrupts generated through chassis intrusion are also fed to
the LM79.

CPU Temperature Monitor

The PATX3070 includes a Maxim MAX1617 device to directly monitor
the temperature of the processor. An over-temperature condition produces
an alarm signal. The MAX1617 allows system management software to
read processor temperatures, set temperature sample rates, specify alarm
threshold values, and clear the alarm output after processing the interrupt.
Alarm signals from the MAX1617 are routed to the LM79 and to the
PIIX4E (refer to the device data sheets and to the PATX3070 BIOS and
Programmer's Reference Guide for programming details).
http://www.motorola.com/computer/literature
Documentation.
Features
3
Appendix
3-3

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