Hologic ThinPrep Operator's Manual page 49

Integrated imager
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Atmospheric pressure
1100 millibar to 500 millibar
Sound levels
Maximum A-weighted sound pressure level at the operator's position and at a bystander's position
is 66.2 dBA.
Power
Voltage
100-120V~/220-240V~ single phase, 50–60 Hz
Power
Less than 150 Watts (512 Btu/hour) for the microscope and controller, not including the
computer
Power cables
Maximum length must be less than 3 m (9.8 ft.).
Fusing
Two 3.15A, 250 VAC, time delay, low break capacity (instrument)
Fuses are not user-accessible and are not intended to be changed by users. Contact Technical
Note:
Support if the instrument does not operate. Do not remove any covers on the components.
Connections to external circuits
The external connections on the PC are PELV (Protected Extra Low Voltage) as defined by IEC
61140. Outputs of other devices connected to the PC should also be PELV or SELV (Safety
Extra Low Voltage). Only devices approved for safety by an appropriate agency should be
connected to the PC.
The computer manufacturer provides documentation for the PC. Refer to that for technical
Note:
specifications. Do not discard.
Safety, EMI and EMC Standards
The Integrated Imager has been tested and certified by a U.S. nationally recognized testing
Laboratory (NRTL) to comply with current Safety, Electro-Magnetic Interference (EMI) and Electro-
Magnetic Compatibility (EMC) standards. Refer to the model/rating label, located on the rear of the
controller, to see the safety certification markings. This equipment meets the IEC 61010-2-101
particular safety requirements for IVD equipment.
This equipment meets the emission and immunity requirements of IEC 61326-2-6. This equipment
has been tested and found to comply to CISPR 11 Class A emission limits.
In a domestic environment it may cause radio interference, in which case, measures to mitigate the
interference may be necessary. The electromagnetic environment should be evaluated prior to
operation of the equipment. Do not use this device in close proximity to sources of strong
electromagnetic radiation (e.g., unshielded RF sources), as these may interfere with the proper
operation.
I
NTRODUCTION
®
ThinPrep
Integrated Imager Operator's Manual
1
1.9

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